| Item | Specification / Description |
|---|---|
| Material | Polyethersulfone (PES) |
| Appearance | Semi-transparent or milky film |
| Thickness | 0.02 mm ~ 0.2 mm (customizable) |
| Width | ≤ 1500 mm (customizable) |
| Softening Point | 230℃ ~ 260℃ |
| Recommended Heat Press Temperature | 250℃ ~ 280℃ |
| Recommended Heat Press Time | 5 ~ 30 seconds |
| Recommended Heat Press Pressure | 0.3 ~ 0.8 MPa |
| Tensile Strength | ≥ 30 MPa |
| Elongation at Break | ≥ 150% |
| Environmental Compliance | RoHS / REACH compliant |
Applications
Electronics Industry: High-temperature electronic component encapsulation, insulation, and fixation
Automotive Manufacturing: Bonding in engine compartments and high-temperature parts
Aerospace: Structural composites and high-temperature sealing components
High-End Manufacturing: Bonding and lamination of mechanical parts
Medical Devices: Bonding components requiring high-temperature sterilization
Instructions for Use
Preparation
Use high-temperature heat press equipment capable of reaching the recommended temperature range.
Ensure bonding surfaces are clean, dry, and free of grease or dust.
Heat Press Operation
Place the PES hot melt adhesive film between substrates.
Apply heat, pressure, and time according to the recommended parameters.
Cooling and Curing
Allow the bonded materials to cool to room temperature for full curing and optimal performance.
Notes
Due to high-temperature operation, safety precautions are necessary.
Conduct small sample tests to optimize process parameters.
Store in a cool, dry place away from direct sunlight and moisture.
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